Distributing Material

Silver-Coated Copper

  • High surface activity
  • The price lower than silver powder
  • Good resistance to silver migration characteristics
  • Apply to electrical and thermal conductivity
  • 3D printing or powder metallurgy

Technical Specifications

產品名稱Product Number 組成 (%) Cu Composition 組成 (%) Ag Composition 粒徑 (μm) D50 Particle Size 形狀 Shape
產品名稱Product Number 組成 (%) Cu Composition 組成 (%) Ag Composition 粒徑 (μm) D50 Particle Size 形狀 Shape
MS-05 95 5 9.11 片狀
MS-02 98 2 11.08 片狀

Application

Electrical Conductive Material  /  Thermal Conductive Material